Spray Technology
Thick Copper Etching
| Board size | Max:510mm × 510mm Min:150mm × 150mm |
|---|---|
| Copper thickness | 100μm - |
| Spray pressure | Standard:0.3MPa（Max:0.4MPa） |
| Chemical | Copper(II) chloride(CuCl2) |
Etching rate
Uniformity (Etching 100μm from Cu: 175μm)
| Board size | Max:510mm × 510mm Min:150mm × 150mm |
|---|---|
| Copper thickness | 100μm - |
| Spray pressure | Standard:0.3MPa（Max:0.4MPa） |
| Chemical | Copper(II) chloride(CuCl2) |